TomatoElec

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Разъемы, штыревые контакты

Производитель Серия Упаковка Состояние продукта Тип разъема Тип контакта Шаг - Сопряжение Количество положений Количество рядов Расстояние между рядами - Сопряжение Количество загруженных позиций Стиль Защита Тип крепления Оконечная нагрузка Тип крепления Длина контакта - Сопряжение Длина контакта - Пост Общая длина контакта Высота изоляции Форма контакта Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Отделка контакта - Пост Материал контакта Материал изоляции Особенности Рабочая температура Номинальный ток (Ампер)

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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип разъема Тип контакта Шаг - Сопряжение Количество положений Количество рядов Расстояние между рядами - Сопряжение Количество загруженных позиций Стиль Защита Тип крепления Оконечная нагрузка Тип крепления Длина контакта - Сопряжение Длина контакта - Пост Общая длина контакта Высота изоляции Форма контакта Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Отделка контакта - Пост Материал контакта Материал изоляции Особенности Рабочая температура Номинальный ток (Ампер)
SLY 1 085 36 G

SLY 1 085 36 G

0.5 MM, STRAIGHT

Fischer Elektronik

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SLY 1 085 36 G

Технический лист

SLY 1 085 - Active Header Male Pin 0.079" (2.00mm) 36 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.157" (4.00mm) 0.118" (3.00mm) 0.335" (8.50mm) 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 8 117 62 Z

SLV W 8 117 62 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

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SLV W 8 117 62 Z

Технический лист

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 62 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 6 415 12 G

SL 6 415 12 G

0.635 MM"S" SE

Fischer Elektronik

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SL 6 415 12 G

Технический лист

SL 6 415 Bulk Active Header Male Pin 0.100" (2.54mm) 12 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.000" (50.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 8 092 44 G

SLV W 8 092 44 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

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SLV W 8 092 44 G

Технический лист

SLV W 8 092 Bulk Active Header Male Pin 0.050" (1.27mm) 44 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 5 415 22 G

SL 5 415 22 G

ONE ROW, 0.635 MM

Fischer Elektronik

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SL 5 415 22 G

Технический лист

SL 5 415 Bulk Active Header Male Pin 0.100" (2.54mm) 22 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.000" (50.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 8 117 36 Z

SLV W 8 117 36 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

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SLV W 8 117 36 Z

Технический лист

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 36 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 6 156 40 G

SL 6 156 40 G

0.635 MM"S" SE

Fischer Elektronik

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SL 6 156 40 G

Технический лист

SL 6 156 - Active Header Male Pin 0.100" (2.54mm) 40 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.980" (24.90mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLY 11 SMD 051 6 G

SLY 11 SMD 051 6 G

ONE ROW, 0.5 MM, SUITABLE FOR

Fischer Elektronik

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SLY 11 SMD 051 6 G

Технический лист

SLY 11 SMD 051 - Active Header Male Pin 0.079" (2.00mm) 6 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.142" (3.60mm) - - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 7 117 30 Z

SLV W 7 117 30 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

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SLV W 7 117 30 Z

Технический лист

SLV W 7 117 Bulk Active Header Male Pin 0.050" (1.27mm) 30 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 6 237 56 G

SL 6 237 56 G

0.635 MM"S" SE

Fischer Elektronik

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SL 6 237 56 G

Технический лист

SL 6 237 Bulk Active Header Male Pin 0.100" (2.54mm) 56 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.299" (33.00mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 6 092 30 Z

SLV W 6 092 30 Z

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

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SLV W 6 092 30 Z

Технический лист

SLV W 6 092 Bulk Active Header Male Pin 0.050" (1.27mm) 30 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 6 415 18 Z

SL 6 415 18 Z

0.635 MM"S" SE

Fischer Elektronik

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SL 6 415 18 Z

Технический лист

SL 6 415 Bulk Active Header Male Pin 0.100" (2.54mm) 18 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.000" (50.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 4 KA 060 6 Z

SLV W 4 KA 060 6 Z

GRID 1.27 X1.27 MM; SUITABLE FO

Fischer Elektronik

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SLV W 4 KA 060 6 Z

Технический лист

SLV W 4 KA 060 - Active Header Male Pin 0.050" (1.27mm) 6 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SL 6 360 54 G

SL 6 360 54 G

0.635 MM"S" SE

Fischer Elektronik

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SL 6 360 54 G

Технический лист

SL 6 360 Bulk Active Header Male Pin 0.100" (2.54mm) 54 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.783" (45.30mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 6 117 31 Z

SLV W 6 117 31 Z

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

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SLV W 6 117 31 Z

Технический лист

SLV W 6 117 Bulk Active Header Male Pin 0.050" (1.27mm) 31 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 11 SMD 133 6 Z

SLY 11 SMD 133 6 Z

ONE ROW, 0.5 MM, SUITABLE FOR

Fischer Elektronik

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SLY 11 SMD 133 6 Z

Технический лист

SLY 11 SMD 133 Bulk Active Header Male Pin 0.079" (2.00mm) 6 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.142" (3.60mm) - - 0.059" (1.50mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 4 KA 060 56 Z

SLV W 4 KA 060 56 Z

GRID 1.27 X1.27 MM; SUITABLE FO

Fischer Elektronik

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SLV W 4 KA 060 56 Z

Технический лист

SLV W 4 KA 060 - Active Header Male Pin 0.050" (1.27mm) 56 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SL 6 156 8 Z

SL 6 156 8 Z

0.635 MM"S" SE

Fischer Elektronik

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SL 6 156 8 Z

Технический лист

SL 6 156 - Active Header Male Pin 0.100" (2.54mm) 8 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.980" (24.90mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLY 11 SMD 133 30 G

SLY 11 SMD 133 30 G

ONE ROW, 0.5 MM, SUITABLE FOR

Fischer Elektronik

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SLY 11 SMD 133 30 G

Технический лист

SLY 11 SMD 133 Tube Active Header Male Pin 0.079" (2.00mm) 30 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.142" (3.60mm) - - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 6 121 36 S

SL 6 121 36 S

0.635 MM"S" SE

Fischer Elektronik

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SL 6 121 36 S

Технический лист

SL 6 121 - Active Header Male Pin 0.100" (2.54mm) 36 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.845" (21.40mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
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