Разъемы, штыревые контакты

Производитель Серия Упаковка Состояние продукта Тип разъема Тип контакта Шаг - Сопряжение Количество положений Количество рядов Расстояние между рядами - Сопряжение Количество загруженных позиций Стиль Защита Тип крепления Оконечная нагрузка Тип крепления Длина контакта - Сопряжение Длина контакта - Пост Общая длина контакта Высота изоляции Форма контакта Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Отделка контакта - Пост Материал контакта Материал изоляции Особенности Рабочая температура Номинальный ток (Ампер)

Сбросить все
Применить ко всем
Результат
Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип разъема Тип контакта Шаг - Сопряжение Количество положений Количество рядов Расстояние между рядами - Сопряжение Количество загруженных позиций Стиль Защита Тип крепления Оконечная нагрузка Тип крепления Длина контакта - Сопряжение Длина контакта - Пост Общая длина контакта Высота изоляции Форма контакта Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Отделка контакта - Пост Материал контакта Материал изоляции Особенности Рабочая температура Номинальный ток (Ампер)
SLY 3 041 10 G

SLY 3 041 10 G

0.5 MM, ANGLED

Fischer Elektronik

0 -
SLY 3 041 10 G

Технический лист

SLY 3 041 Bulk Active Header Male Pin 0.079" (2.00mm) 10 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.161" (4.10mm) 0.110" (2.80mm) - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL LP 7 SMD 040 12 S

SL LP 7 SMD 040 12 S

0.635 MM, LOW PROFILE IN SMD-T

Fischer Elektronik

0 -
SL LP 7 SMD 040 12 S

Технический лист

SL LP 7 SMD 040 Bulk Active Header Male Pin 0.100" (2.54mm) 12 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.157" (4.00mm) 0.150" (3.80mm) 0.374" (9.50mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 2 139 32 Z

SLY 2 139 32 Z

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
SLY 2 139 32 Z

Технический лист

SLY 2 139 Bulk Active Header Male Pin 0.079" (2.00mm) 32 2 0.079" (2.00mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.370" (9.40mm) 0.118" (3.00mm) 0.547" (13.90mm) 0.059" (1.50mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 1 098 39 S

SLY 1 098 39 S

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
SLY 1 098 39 S

Технический лист

SLY 1 098 Tube Active Header Male Pin 0.079" (2.00mm) 39 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.209" (5.30mm) 0.118" (3.00mm) 0.386" (9.80mm) 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 9 SMD 040 25 Z B SM

SLY 9 SMD 040 25 Z B SM

0.5 MM

Fischer Elektronik

0 -
SLY 9 SMD 040 25 Z B SM

Технический лист

SLY 9 SMD 040 Bulk Active Header Male Pin 0.079" (2.00mm) 25 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.157" (4.00mm) 0.130" (3.30mm) 0.346" (8.80mm) 0.059" (1.50mm) Circular Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 10 SMD 040 20 G B SM

SLY 10 SMD 040 20 G B SM

0.5 MM

Fischer Elektronik

0 -
SLY 10 SMD 040 20 G B SM

Технический лист

SLY 10 SMD 040 Tube Active Header Male Pin 0.079" (2.00mm) 20 2 0.079" (2.00mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.157" (4.00mm) 0.268" (6.80mm) - 0.059" (1.50mm) Circular Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 9 SMD 040 26 G B SM

SLY 9 SMD 040 26 G B SM

0.5 MM

Fischer Elektronik

0 -
SLY 9 SMD 040 26 G B SM

Технический лист

SLY 9 SMD 040 Tube Active Header Male Pin 0.079" (2.00mm) 26 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.157" (4.00mm) 0.130" (3.30mm) 0.346" (8.80mm) 0.059" (1.50mm) Circular Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 2 085 14 S

SLY 2 085 14 S

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
SLY 2 085 14 S

Технический лист

SLY 2 085 Bulk Active Header Male Pin 0.079" (2.00mm) 14 2 0.079" (2.00mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.157" (4.00mm) 0.118" (3.00mm) 0.335" (8.50mm) 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 9 SMD 040 36 S

SLY 9 SMD 040 36 S

0.5 MM

Fischer Elektronik

0 -
SLY 9 SMD 040 36 S

Технический лист

SLY 9 SMD 040 Bulk Active Header Male Pin 0.079" (2.00mm) 36 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.157" (4.00mm) 0.130" (3.30mm) 0.346" (8.80mm) 0.059" (1.50mm) Circular Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL LP 6 SMD 066 24 G

SL LP 6 SMD 066 24 G

0.635 MM, LOW PROFILE IN SMD-T

Fischer Elektronik

0 -
SL LP 6 SMD 066 24 G

Технический лист

SL LP 6 SMD 066 - Active Header Male Pin 0.100" (2.54mm) 24 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.260" (6.60mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 8 117 44 G

SLV W 8 117 44 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
SLV W 8 117 44 G

Технический лист

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 44 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 7 092 42 Z

SLV W 7 092 42 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
SLV W 7 092 42 Z

Технический лист

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 42 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 3 082 23 Z

SLY 3 082 23 Z

0.5 MM, ANGLED

Fischer Elektronik

0 -
SLY 3 082 23 Z

Технический лист

SLY 3 082 Bulk Active Header Male Pin 0.079" (2.00mm) 23 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.323" (8.20mm) 0.110" (2.80mm) - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 7 092 14 Z

SLV W 7 092 14 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
SLV W 7 092 14 Z

Технический лист

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 14 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 3 041 37 Z

SLY 3 041 37 Z

0.5 MM, ANGLED

Fischer Elektronik

0 -
SLY 3 041 37 Z

Технический лист

SLY 3 041 Bulk Active Header Male Pin 0.079" (2.00mm) 37 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.161" (4.10mm) 0.110" (2.80mm) - 0.059" (1.50mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 8 117 28 G

SLV W 8 117 28 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
SLV W 8 117 28 G

Технический лист

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 28 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 4 041 24 G

SLY 4 041 24 G

0.5 MM, ANGLED

Fischer Elektronik

0 -
SLY 4 041 24 G

Технический лист

SLY 4 041 Bulk Active Header Male Pin 0.079" (2.00mm) 24 2 0.079" (2.00mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.161" (4.10mm) 0.110" (2.80mm) - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 8 117 60 Z

SLV W 8 117 60 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
SLV W 8 117 60 Z

Технический лист

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 60 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 4 041 20 G

SLY 4 041 20 G

0.5 MM, ANGLED

Fischer Elektronik

0 -
SLY 4 041 20 G

Технический лист

SLY 4 041 Bulk Active Header Male Pin 0.079" (2.00mm) 20 2 0.079" (2.00mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.161" (4.10mm) 0.110" (2.80mm) - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 7 092 8 Z

SLV W 7 092 8 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
SLV W 7 092 8 Z

Технический лист

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 8 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
TomatoElec

Поиск

TomatoElec

Продукты

TomatoElec

Телефон

TomatoElec

Пользователь