TomatoElec

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RFI и EMI — контакты, напальчники и прокладки

Производитель Серия Упаковка Состояние продукта Тип Форма Ширина Длина Высота Материал Покрытие Покрытие - толщина Способ крепления Рабочая температура

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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Форма Ширина Длина Высота Материал Покрытие Покрытие - толщина Способ крепления Рабочая температура
8200-9055-81

8200-9055-81

RFI GASKET ELASTOMER

Leader Tech Inc.

0 -
8200-9055-81

Технический лист

- Bulk Active Gasket - - - - Conductive Elastomer - - - -62°C ~ 260°C
0097056019

0097056019

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -

-

- Bulk Active Fingerstock - 0.190" (4.83mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0097055519

0097055519

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -
0097055519

Технический лист

Twist Bulk Active Fingerstock - 0.340" (8.64mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0077001417

0077001417

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -

-

77 Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.220" (5.59mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0077001419

0077001419

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -

-

77 Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.220" (5.59mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
37-131-1039-09600

37-131-1039-09600

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

0 -
37-131-1039-09600

Технический лист

SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 0.591" (15.00mm) 8.00' (2.44m) 0.387" (9.83mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
0097056417

0097056417

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

0 -
0097056417

Технический лист

Clip-On Twist Bulk Active Fingerstock - 0.210" (5.33mm) 16.000" (406.40mm) 0.140" (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
0098054102

0098054102

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0 -

-

Ultrasoft Foldover Bulk Active Fingerstock - 0.380" (9.65mm) 16.000" (406.40mm) 0.120" (3.05mm) Beryllium Copper - - Adhesive 121°C
0098095417

0098095417

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -

-

Ultrasoft Symmetrical (S3) Slotted Bulk Active Fingerstock - 0.450" (11.43mm) 15.000" (381.00mm) 0.140" (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
4208PA51G07200

4208PA51G07200

RFI FOF GASKET ADH

Laird Technologies EMI

0 -
4208PA51G07200

Технический лист

51G Bulk Active Fabric Over Foam Rectangle 0.394" (10.00mm) 72.000" (182.88cm) 1.000" (25.40mm) - - - Adhesive -
8516-0120-72

8516-0120-72

RFI GASKET

Laird Technologies EMI

0 -

-

Electroseal™ Bulk Active Gasket - 1.031" (26.19mm) - - - - - - -
0097055919

0097055919

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -
0097055919

Технический лист

Twist Bulk Active Fingerstock - 0.300" (7.62mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
11-45CD-BD-16

11-45CD-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
11-45CD-BD-16

Технический лист

- Bulk Active Fingerstock - 0.450" (11.43mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
387012273

387012273

UFR,BECU,SBNI,RL 0.5

Laird Technologies EMI

0 -

-

Ultraflex Bulk Active - - - - - - - - - -
0C98044002

0C98044002

RFI FINGERSTOCK BECU UNPLAT ADH

Laird Technologies EMI

0 -

-

Ultrasoft Large Enclosure Bulk Active Fingerstock - 1.630" (41.40mm) 25.00' (7.60m) 0.410" (10.41mm) Beryllium Copper Unplated - Adhesive 121°C
0097029019

0097029019

RFI FINGERSTOCK NICKEL

Laird Technologies EMI

0 -

-

- Bulk Active Fingerstock - - - - - Nickel 299.21µin (7.60µm) - 121°C
13-37AH-BD-16

13-37AH-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
13-37AH-BD-16

Технический лист

- Bulk Active Fingerstock - 0.370" (9.40mm) 16.000" (406.40mm) 0.130" (3.30mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
14-S-37FSV30-BD-16

14-S-37FSV30-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -

-

- Bulk Active Fingerstock - 0.370" (9.40mm) 16.000" (406.40mm) 0.140" (3.56mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
7-13U-BD-12

7-13U-BD-12

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
7-13U-BD-12

Технический лист

- Bulk Active Fingerstock - 0.130" (3.30mm) 12.000" (304.80mm) 0.070" (1.78mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
4358PA51H09600

4358PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4358PA51H09600

Технический лист

51H Bulk Active Fabric Over Foam D-Shape 0.098" (2.50mm) 96.000" (2.44m) 0.059" (1.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
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