TomatoElec

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RFI и EMI — контакты, напальчники и прокладки

Производитель Серия Упаковка Состояние продукта Тип Форма Ширина Длина Высота Материал Покрытие Покрытие - толщина Способ крепления Рабочая температура

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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Форма Ширина Длина Высота Материал Покрытие Покрытие - толщина Способ крепления Рабочая температура
0C98053817

0C98053817

AP,COIL,SNB,USFT,PSA .250X.780X.

Laird Technologies EMI

0 -

-

- Bulk Active - - - - - - - - - -
0097065419

0097065419

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0 -

-

- Bulk Active Fingerstock - - 12.000" (304.80mm) 0.064" (1.63mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
14-45DTS-BD-15-NTP

14-45DTS-BD-15-NTP

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
14-45DTS-BD-15-NTP

Технический лист

- Bulk Active Fingerstock - 0.450" (11.43mm) 15.000" (381.00mm) 0.140" (3.56mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
25-109FSDS-BD-24

25-109FSDS-BD-24

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
25-109FSDS-BD-24

Технический лист

- Bulk Active Fingerstock - 1.090" (27.69mm) 24.000" (609.60mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
6-S-34TV-BD-24

6-S-34TV-BD-24

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
6-S-34TV-BD-24

Технический лист

- Bulk Active Fingerstock - 0.340" (8.64mm) 24.000" (609.60mm) 0.060" (1.52mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
25-109C-070-BD-16

25-109C-070-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
25-109C-070-BD-16

Технический лист

- Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
25-109C-120-BD-16

25-109C-120-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
25-109C-120-BD-16

Технический лист

- Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
25-109C-130-BD-16

25-109C-130-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
25-109C-130-BD-16

Технический лист

- Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0097065519

0097065519

RFI FINGERSTOCK BECU SLOT

Laird Technologies EMI

0 -
0097065519

Технический лист

Clip-On Bulk Active Fingerstock - - - - Beryllium Copper - - Slot 121°C
3-20T-ZNC-24

3-20T-ZNC-24

RFI FINGERSTOCK BECU ZINC ADH

Leader Tech Inc.

0 -
3-20T-ZNC-24

Технический лист

- Bulk Active Fingerstock - 0.200" (5.08mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Zinc + Clear Chromate Flash Adhesive -55°C ~ 121°C
0097064017

0097064017

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

0 -

-

- Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.330" (8.38mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
10-30C-050-DL-BD-16

10-30C-050-DL-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
10-30C-050-DL-BD-16

Технический лист

TechMESH Bulk Active Fingerstock - 0.300" (7.62mm) 16.000" (406.40mm) 0.100" (2.54mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0097043502

0097043502

FINGERSTOCK BECU 24X64MM

Laird Technologies EMI

0 -

-

- Box Obsolete - Angled 0.945" (24.00mm) 2.520" (64.00mm) - - - - - -
4090PA51H09600

4090PA51H09600

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -

-

51H Bulk Active Fabric Over Foam D-Shape 0.090" (2.29mm) 8.00' (2.44m) 0.125" (3.18mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
32-S-78AH-BD-16

32-S-78AH-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
32-S-78AH-BD-16

Технический лист

- Bulk Active Fingerstock - 0.780" (19.81mm) 16.000" (406.40mm) 0.320" (8.13mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
20-38RBCT-SN-16

20-38RBCT-SN-16

RFI FINGERSTOCK BECU TIN ADH

Leader Tech Inc.

0 -
20-38RBCT-SN-16

Технический лист

- Bulk Active Fingerstock - 0.380" (9.65mm) 16.000" (406.40mm) 0.200" (5.08mm) Beryllium Copper Tin Flash Adhesive -55°C ~ 121°C
4-53D-BD-16

4-53D-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
4-53D-BD-16

Технический лист

- Bulk Active Fingerstock - 0.530" (13.46mm) 16.000" (406.40mm) 0.040" (1.02mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
4320AC51G04800

4320AC51G04800

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -

-

51G Bulk Active Fabric Over Foam D-Shape 0.140" (3.56mm) 4.00' (1.22m) 0.050" (1.27mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
8-92RC-BD-16

8-92RC-BD-16

RFI FINGERSTOCK BECU UNPLAT ADH

Leader Tech Inc.

0 -
8-92RC-BD-16

Технический лист

- Bulk Active Fingerstock - 0.920" (23.37mm) 16.000" (406.40mm) 0.080" (2.03mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
0098065517

0098065517

RFI FINGERSTOCK BECU TIN CLIP

Laird Technologies EMI

0 -

-

Ultrasoft Clip-On Bulk Active Fingerstock - - 11.945" (303.40mm) 0.305" (7.75mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
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