TomatoElec

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RFI и EMI — контакты, напальчники и прокладки

Производитель Серия Упаковка Состояние продукта Тип Форма Ширина Длина Высота Материал Покрытие Покрытие - толщина Способ крепления Рабочая температура

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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Форма Ширина Длина Высота Материал Покрытие Покрытие - толщина Способ крепления Рабочая температура
3021004

3021004

RFI FOF GASKET PU ADH

Würth Elektronik

3 -
3021004

Технический лист

WE-LT Bag Active Fabric Over Foam Rectangle 0.394" (10.00mm) 39.370" (1.00m) 0.157" (4.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
4049PA51H01800

4049PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

23 -
4049PA51H01800

Технический лист

51H Bulk Active Fabric Over Foam Square 0.252" (6.40mm) 18.000" (457.20mm) 0.252" (6.40mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
30302015

30302015

RFI FOF GASKET PU ADH

Würth Elektronik

0 -
30302015

Технический лист

WE-LT Bulk Active Fabric Over Foam D-Shape 0.079" (2.00mm) 39.370" (1.00m) 0.059" (1.50mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
77-12-3270-02400

77-12-3270-02400

RFI FOF GASKET NI/CU ADH

Parker Chomerics

0 -
77-12-3270-02400

Технический лист

SOFT-SHIELD® 3500 Box Active Fabric Over Foam Square 0.251" (6.38mm) 24.000" (609.60mm) 0.251" (6.38mm) Nickel-Copper over Urethane Foam - - Adhesive -40°C ~ 70°C
3021003

3021003

RFI FOF GASKET PU ADH

Würth Elektronik

0 -
3021003

Технический лист

WE-LT Bulk Active Fabric Over Foam Rectangle 0.394" (10.00mm) 39.370" (1.00m) 0.118" (3.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
37-131-1008-02400

37-131-1008-02400

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

0 -
37-131-1008-02400

Технический лист

SOFT-SHIELD® 3700 Bulk Active Fabric Over Foam Rectangle 0.118" (2.99mm) 24.000" (609.60mm) 0.075" (1.91mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
4168PAH1K01800

4168PAH1K01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4168PAH1K01800

Технический лист

Sculpted Foam UL94 Bulk Active Fabric Over Foam C-Fold 0.315" (8.00mm) 18.000" (457.20mm) 0.315" (8.00mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -
3-23T-SN-24

3-23T-SN-24

RFI FINGERSTOCK BECU TIN ADH

Leader Tech Inc.

0 -
3-23T-SN-24

Технический лист

- Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Tin Flash Adhesive -55°C ~ 121°C
0097054202

0097054202

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -
0097054202

Технический лист

Foldover Box Active Fingerstock - 0.250" (6.35mm) 15.984" (406.00mm) 0.080" (2.03mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Adhesive 121°C
0097054002

0097054002

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -
0097054002

Технический лист

All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 15.984" (406.00mm) 0.110" (2.79mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Adhesive 121°C
0097065502

0097065502

RFI FINGERSTOCK BECU NICKEL CLIP

Laird Technologies EMI

0 -
0097065502

Технический лист

Clip-On Box Active Fingerstock - 0.067" (1.70mm) 12.008" (305.00mm) 0.093" (2.36mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Clip -
0097065602

0097065602

RFI FINGERSTOCK BECU NICKEL CLIP

Laird Technologies EMI

0 -
0097065602

Технический лист

Clip-On Bulk Active Fingerstock - 0.543" (13.80mm) 15.984" (406.00mm) 0.125" (3.17mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Clip -
4850-12-1212-0100

4850-12-1212-0100

RFI COND FOAM URATHANE PSA

Parker Chomerics

5 -
4850-12-1212-0100

Технический лист

SOFT-SHIELD® 4850 Bulk Active Conductive Foam Sheet 12.000" (304.80mm) 12.000" (304.80mm) 0.039" (1.00mm) Urethane Foam w/ Silver Fibers - - Conductive PSA -40°C ~ 70°C
4850-12-1212-0150

4850-12-1212-0150

RFI COND FOAM URATHANE PSA

Parker Chomerics

2 -
4850-12-1212-0150

Технический лист

SOFT-SHIELD® 4850 Bulk Active Conductive Foam Sheet 12.000" (304.80mm) 12.000" (304.80mm) 0.059" (1.50mm) Urethane Foam w/ Silver Fibers - - Conductive PSA -40°C ~ 70°C
67B5G2504004108R00

67B5G2504004108R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

0 -
67B5G2504004108R00

Технический лист

B5G Bulk Active Fingerstock - 0.098" (2.50mm) 0.157" (4.00mm) 0.161" (4.10mm) Beryllium Copper Gold - Solder -
331171302035

331171302035

RFI SHLD FINGER BECU GOLD SOLDER

Würth Elektronik

7 -
331171302035

Технический лист

WE-SECF Tape & Reel (TR) Active Shield Finger - 0.079" (2.00mm) 0.118" (3.00mm) 0.138" (3.50mm) Beryllium Copper Gold Flash Solder -40°C ~ 100°C
78631603012

78631603012

RFI SHLD FINGER BECU GOLD

Würth Elektronik

14 -
78631603012

Технический лист

WE-SCFA Tape & Reel (TR) Active Shield Finger - 0.118" (3.00mm) 0.236" (6.00mm) 0.472" (12.00mm) Beryllium Copper Gold - - -40°C ~ 100°C
0097097302

0097097302

CARD GUI CLIPON BECU 3.05X9.53MM

Laird Technologies EMI

0 -
0097097302

Технический лист

Card Guide Clip-On Box Active - - 0.120" (3.05mm) 0.375" (9.53mm) - - - - - -
30323231

30323231

RFI FOF GASKET PU ADH

Würth Elektronik

1 -
30323231

Технический лист

WE-LT Bag Active Fabric Over Foam D-Shape 0.091" (2.30mm) 39.370" (1.00m) 0.091" (2.30mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
10-04-1687-6502

10-04-1687-6502

RFI GASKET ELASTOMER NICKEL

Parker Chomerics

0 -
10-04-1687-6502

Технический лист

- Spool Active Gasket Round 0.070" (1.78mm) 12.000" (304.80mm) - Conductive Elastomer Nickel - No Adhesive -29°C ~ 66°C
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