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Производитель Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура

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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
XR2T-2021-N

XR2T-2021-N

CONN IC DIP SOCKET 20POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2T-2021-N

Технический лист

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
XR2A-1625

XR2A-1625

CONN IC DIP SOCKET 16POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2A-1625

Технический лист

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
ICO-316-SGG

ICO-316-SGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-316-SGG

Технический лист

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
XR2A-0802

XR2A-0802

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

54 -
XR2A-0802

Технический лист

XR2 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
524-AG11D-ES

524-AG11D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
524-AG11D-ES

Технический лист

500 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
3-1571551-2

3-1571551-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

0 -
3-1571551-2

Технический лист

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
528-AG12D

528-AG12D

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

81 -
528-AG12D

Технический лист

500 Tray Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyester -55°C ~ 105°C
110-13-318-41-801000

110-13-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

80 -
110-13-318-41-801000

Технический лист

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
848-AG10D

848-AG10D

CONN IC DIP SOCKET 48POS GOLD

TE Connectivity AMP Connectors

41 -
848-AG10D

Технический лист

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - Copper Alloy Polyester -55°C ~ 105°C
299-93-318-10-001000

299-93-318-10-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

64 -
299-93-318-10-001000

Технический лист

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-616-10-002000

299-43-616-10-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

84 -
299-43-616-10-002000

Технический лист

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-43-652-41-005000

117-43-652-41-005000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

32 -
117-43-652-41-005000

Технический лист

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
2043650006

2043650006

P&S Conn 6MM CST SMT SOCKET W/1M

Molex

15 -
2043650006

Технический лист

* Tray Active - - - - - - - - - - - - - - -
3-1571550-2

3-1571550-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

0 -
3-1571550-2

Технический лист

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8060-1G9

8060-1G9

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

0 -
8060-1G9

Технический лист

8060 Bulk Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Panel Mount Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
2-1437504-6

2-1437504-6

8060-1G9=GOLD TRANSISTOR SOCKE

TE Connectivity AMP Connectors

38 -
2-1437504-6

Технический лист

8060 Bulk Active Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Panel Mount Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
110-13-628-41-801000

110-13-628-41-801000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

86 -
110-13-628-41-801000

Технический лист

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
2040540-2

2040540-2

CONN SOCKET LGA 1156POS GOLD

TE Connectivity AMP Connectors

0 -
2040540-2

Технический лист

- Tray Active LGA 1156 (34 x 34) 0.036" (0.91mm) Gold Flash Copper Alloy Surface Mount Closed Frame Solder 0.039" (1.00mm) - - Copper Alloy Thermoplastic -
117-43-664-41-005000

117-43-664-41-005000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

53 -
117-43-664-41-005000

Технический лист

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-324-G-N

APA-324-G-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-324-G-N

Технический лист

APA Bulk Active - 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
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