TomatoElec

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Производитель Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура

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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
1571994-2

1571994-2

CONN SOCKET SIP 2POS GOLD

TE Connectivity AMP Connectors

0 -
1571994-2

Технический лист

510 Bulk Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
612-83-304-41-001101

612-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
612-83-304-41-001101

Технический лист

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP1X05-041B

SIP1X05-041B

SIP1X05-041B-SIP SOCKET 5 CTS

Amphenol ICC (FCI)

0 -
SIP1X05-041B

Технический лист

SIP1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
1-390263-5

1-390263-5

CONN IC DIP SOCKET 42POS TIN

TE Connectivity AMP Connectors

0 -
1-390263-5

Технический лист

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
1-390262-6

1-390262-6

CONN IC DIP SOCKET 42POS TIN

TE Connectivity AMP Connectors

0 -
1-390262-6

Технический лист

- Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
614-87-306-41-001101

614-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
614-87-306-41-001101

Технический лист

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 22-HZL/7-TT

AR 22-HZL/7-TT

SOCKET

Assmann WSW Components

0 -

-

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Brass Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-87-306-41-105101

110-87-306-41-105101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
110-87-306-41-105101

Технический лист

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS28-Z-SM

A-CCS28-Z-SM

CONN SOCKET PLCC 28POS TIN

Assmann WSW Components

0 -
A-CCS28-Z-SM

Технический лист

- Bag Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
A18-LCG

A18-LCG

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

0 -

-

- - Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
AW 127-20/Z-T

AW 127-20/Z-T

SOCKET 20 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-20/Z-T

Технический лист

- Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS) -40°C ~ 105°C
612-87-306-41-001101

612-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
612-87-306-41-001101

Технический лист

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS32-Z-SM

A-CCS32-Z-SM

CONN SOCKET PLCC 32POS TIN

Assmann WSW Components

0 -
A-CCS32-Z-SM

Технический лист

- Bag Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
03-0518-10T

03-0518-10T

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0518-10T

Технический лист

518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
01-0517-90C

01-0517-90C

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0517-90C

Технический лист

0517 Bulk Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
AR16-HZL/07-TT

AR16-HZL/07-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

0 -
AR16-HZL/07-TT

Технический лист

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
116-87-304-41-002101

116-87-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-002101

Технический лист

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
241-06-1-03

241-06-1-03

CONN IC DIP SOCKET 6POS TIN

CNC Tech

0 -
241-06-1-03

Технический лист

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 10-HZL/01-TT

AR 10-HZL/01-TT

CONN IC DIP SOCKET 10POS TIN

Assmann WSW Components

0 -
AR 10-HZL/01-TT

Технический лист

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A-CCS20-Z

A-CCS20-Z

CONN SOCKET PLCC 20POS TIN

Assmann WSW Components

0 -
A-CCS20-Z

Технический лист

- Bag Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
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