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RFI и EMI — контакты, напальчники и прокладки

Производитель Серия Упаковка Состояние продукта Тип Форма Ширина Длина Высота Материал Покрытие Покрытие - толщина Способ крепления Рабочая температура

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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Форма Ширина Длина Высота Материал Покрытие Покрытие - толщина Способ крепления Рабочая температура
4186PA51H00100

4186PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4186PA51H00100

Технический лист

51H Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 1.000" (25.40mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
10117780-001LF

10117780-001LF

RFI FINGERSTOCK CU GOLD SOLDER

Amphenol ICC (FCI)

0 -
10117780-001LF

Технический лист

- Tape & Reel (TR) Active Fingerstock - 0.236" (6.00mm) 0.268" (6.80mm) 0.083" (2.10mm) Copper Alloy Gold 30.0µin (0.76µm) Solder -
4052AC51H00071

4052AC51H00071

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4052AC51H00071

Технический лист

51H Bulk Active Fabric Over Foam D-Shape 0.079" (2.00mm) 0.710" (18.03mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
10121135-001LF

10121135-001LF

RFI FINGERSTOCK CU GOLD SOLDER

Amphenol ICC (FCI)

0 -
10121135-001LF

Технический лист

- Tube Obsolete Fingerstock - 0.315" (8.00mm) 0.470" (11.95mm) 0.138" (3.50mm) Copper Alloy Gold 30.0µin (0.76µm) Solder -
4520PA51G00100

4520PA51G00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -

-

51G Bulk Active Fabric Over Foam Square 0.080" (2.03mm) 1.000" (25.40mm) 0.080" (2.03mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
120220-0313

120220-0313

RFI SHD FINGER TITAN CU NICK SLD

ITT Cannon, LLC

0 -
120220-0313

Технический лист

- Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.038" (0.96mm) 0.147" (3.73mm) 0.118" (3.00mm) Titanium Copper Nickel 118.11µin (3.00µm) Solder -
67SLA060080070PI00

67SLA060080070PI00

SLA W6XH8XL7MM

Laird Technologies EMI

0 -

-

SMD Contact Bulk Obsolete - - - - - - - - - -
120220-0315

120220-0315

RFI SHD FINGER TITAN CU NICK SLD

ITT Cannon, LLC

0 -
120220-0315

Технический лист

- Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.038" (0.96mm) 0.157" (3.99mm) 0.157" (4.00mm) Titanium Copper Nickel 118.11µin (3.00µm) Solder -
1-1447360-1

1-1447360-1

RFI SHLD FINGER CU GOLD SOLDER

TE Connectivity AMP Connectors

0 -
1-1447360-1

Технический лист

- Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.039" (1.00mm) 0.138" (3.50mm) 0.055" (1.40mm) Copper Alloy Gold 1.967µin (0.05µm) Solder -
1554825-1

1554825-1

RFI SHLD FINGER CU GOLD SOLDER

TE Connectivity AMP Connectors

0 -
1554825-1

Технический лист

- Bag Active Shield Finger, Pre-Loaded - 0.045" (1.15mm) 0.094" (2.40mm) 0.051" (1.30mm) Copper Alloy Gold Flash Solder -
BMI-C-001-SN

BMI-C-001-SN

RFI SHLD FINGER BECU TIN SOLDER

Laird Technologies EMI

0 -
BMI-C-001-SN

Технический лист

BMI-C Tape & Reel (TR) Active Shield Finger - 0.079" (2.00mm) 0.122" (3.11mm) 0.096" (2.44mm) Beryllium Copper Tin - Solder -
10103958-001LF

10103958-001LF

RFI FINGERSTOCK CU TIN

Amphenol ICC (FCI)

0 -
10103958-001LF

Технический лист

- Tape & Reel (TR) Active Fingerstock - 0.315" (8.00mm) 0.470" (11.95mm) 0.132" (3.35mm) Copper Alloy Tin 30.0µin (0.76µm) - -
4912PA51H00100

4912PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -

-

51H Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 1.000" (25.40mm) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
67BCG2504303510R00

67BCG2504303510R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

0 -
67BCG2504303510R00

Технический лист

BCG Bulk Active Fingerstock - 0.098" (2.50mm) 0.169" (4.30mm) 0.138" (3.50mm) Beryllium Copper Gold - Solder -
4157PA51H00100

4157PA51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -

-

ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.787" (20.00mm) 1.000" (25.40mm) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
SMG118157R-0.197

SMG118157R-0.197

RFI FILM OVER FOAM PU

Leader Tech Inc.

0 -
SMG118157R-0.197

Технический лист

- Tape & Reel (TR) Obsolete Film Over Foam Rectangle 0.157" (4.00mm) 0.197" (5.00mm) 0.118" (3.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - - -
SMG256197R-0.118

SMG256197R-0.118

RFI FILM OVER FOAM PU

Leader Tech Inc.

0 -
SMG256197R-0.118

Технический лист

- Tape & Reel (TR) Obsolete Film Over Foam Rectangle 0.197" (5.00mm) 0.256" (6.50mm) 0.118" (3.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - - -
67BCG2003201508R00

67BCG2003201508R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

0 -
67BCG2003201508R00

Технический лист

BCG Bulk Active Fingerstock - 0.078" (2.00mm) 0.126" (3.20mm) 0.059" (1.50mm) Beryllium Copper Gold - Solder -
10116189-001LF

10116189-001LF

RFI FINGERSTOCK CU GOLD

Amphenol ICC (FCI)

0 -
10116189-001LF

Технический лист

- Tape & Reel (TR) Active Fingerstock - - - - Copper Alloy Gold 3.00µin (0.076µm) - -
67B5N4004005108R00

67B5N4004005108R00

SP,CON,TNR 5.10X4.00X4.00MM

Laird Technologies EMI

0 -

-

- Cut Tape (CT) Active - - - - - - - - - -
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