TomatoElec

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RFI и EMI — контакты, напальчники и прокладки

Производитель Серия Упаковка Состояние продукта Тип Форма Ширина Длина Высота Материал Покрытие Покрытие - толщина Способ крепления Рабочая температура

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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Форма Ширина Длина Высота Материал Покрытие Покрытие - толщина Способ крепления Рабочая температура
4788PB51H00100

4788PB51H00100

RFI FOF GASKET PU ADH

Laird Technologies EMI

0 -
4788PB51H00100

Технический лист

ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.250" (6.35mm) 1.000" (25.40mm) 0.125" (3.18mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
2040761-1

2040761-1

RFI SHLD FINGER CU GOLD SOLDER

TE Connectivity AMP Connectors

0 -
2040761-1

Технический лист

- Tape & Reel (TR) Obsolete Shield Finger, Pre-Loaded - 0.079" (2.00mm) 0.204" (5.17mm) 0.078" (1.99mm) Copper Alloy Gold Flash Solder -
67SLG040040025PI00

67SLG040040025PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

0 -
67SLG040040025PI00

Технический лист

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Rectangle 0.157" (4.00mm) 0.098" (2.50mm) 0.157" (4.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
S1711-06R

S1711-06R

RFI SHLD CLIP SS TIN SOLDER

Harwin Inc.

0 -

-

EZ BoardWare Tape & Reel (TR) Obsolete Shield Clip - 0.090" (2.28mm) 0.346" (8.79mm) 0.140" (3.55mm) Stainless Steel Tin 118.11µin (3.00µm) Solder -40°C ~ 125°C
4084AA51K00100

4084AA51K00100

RFI FOF GASKET PU

Laird Technologies EMI

0 -
4084AA51K00100

Технический лист

51K Bulk Active Fabric Over Foam Square 0.500" (12.70mm) 1.000" (25.40mm) 0.500" (12.70mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
4692PA51G00200

4692PA51G00200

RFI FOF GASKET ADH

Laird Technologies EMI

0 -
4692PA51G00200

Технический лист

51G Bulk Active Fabric Over Foam D-Shape 0.252" (6.40mm) 2.000" (50.80mm) 0.142" (3.60mm) - - - Adhesive -
67B7G2504005010R00

67B7G2504005010R00

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

0 -
67B7G2504005010R00

Технический лист

- Bulk Active Fingerstock - 0.098" (2.50mm) 0.157" (4.00mm) 0.197" (5.00mm) Beryllium Copper Gold - Solder -
0077001615

0077001615

RFI FINGERSTOCK BECU ZINC SLOT

Laird Technologies EMI

0 -
0077001615

Технический лист

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper Zinc + Clear Chromate 299.21µin (7.60µm) Slot 121°C
67SLH050050030PI00

67SLH050050030PI00

RFI FILM OVER FOAM PU SOLDER

Laird Technologies EMI

0 -
67SLH050050030PI00

Технический лист

SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Hourglass 0.197" (5.00mm) 0.118" (3.00mm) 0.197" (5.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
77-1N-3617-09600

77-1N-3617-09600

SOFT-SHIELD 3500, FOF, D-SHAPE

Parker Chomerics

0 -
77-1N-3617-09600

Технический лист

SOFT-SHIELD® 3500 Spool Active Fabric Over Foam D-Shape 0.197" (5.00mm) 96.000" (2.44m) 0.256" (6.50mm) Nickel-Copper Taffeta over Urethane Foam - Halogen Free Nickel - Adhesive -40°C ~ 70°C
67B5G4004005108R0B

67B5G4004005108R0B

RFI FINGERSTOCK BECU GOLD SOLDER

Laird Technologies EMI

0 -
67B5G4004005108R0B

Технический лист

B5G Bulk Active Fingerstock - 0.157" (4.00mm) 0.157" (4.00mm) 0.201" (5.10mm) Beryllium Copper Gold - Solder -
0077001817

0077001817

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0 -
0077001817

Технический лист

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.543" (13.79mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Slot 121°C
0077001617

0077001617

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0 -
0077001617

Технический лист

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Slot 121°C
0077001717

0077001717

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0 -
0077001717

Технический лист

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.356" (9.04mm) 0.110" (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot 121°C
0077001719

0077001719

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0 -
0077001719

Технический лист

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.356" (9.04mm) 0.110" (2.79mm) Beryllium Copper Nickel 299.99µin (7.62µm) Slot 121°C
0077001819

0077001819

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0 -
0077001819

Технический лист

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.543" (13.79mm) 0.110" (2.79mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
0077002417

0077002417

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0 -
0077002417

Технический лист

Slot Mount Bulk Active Fingerstock - 0.370" (9.40mm) 0.475" (12.07mm) 0.130" (3.30mm) Beryllium Copper Tin 299.99µin (7.62µm) Slot 121°C
0077006217

0077006217

RFI FINGERSTOCK BECU TIN SLOT

Laird Technologies EMI

0 -
0077006217

Технический лист

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Slot 121°C
0077006219

0077006219

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0 -
0077006219

Технический лист

Slot Mount Bulk Active Fingerstock - 0.320" (8.13mm) 0.169" (4.29mm) 0.110" (2.79mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
0078001519

0078001519

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

0 -
0078001519

Технический лист

Ultrasoft Slot Mount Bulk Active Fingerstock - 0.600" (15.24mm) 0.250" (6.35mm) 0.220" (5.59mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
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